Agilent Technologies is to expand its EDA range with the launch of cut price 3D electromagnetic (EM) simulation in response to RF and microwave designer demands.

“We’ve been watching this space and our customers are saying they’re keen for us to get into it,” Jim McGillivary, vice--president of Agilent Technologies’ EEsof EDA division, told Electronics Weekly at the IEEE Radio and Wireless Symposium in San Diego.

3D EM simulation allows the characterisation and analysis of high frequency communications designs, taking into account the effect that things like bond wires start to have on circuits as the frequency increases. “These effects are starting to come into chip and board design so customers need to model them,” said McGillivary.

There are companies already offering 3D EM simulation, but McGillivary said its customers complain that current 3D EM offerings are very expensive.

“The technology is difficult but not that unique, yet companies are charging $50k-$60k so there’s a real chance to shake up the market,” said McGillivary. “We’re making a bold statement and doing it for $15k. We’ve got a reputation for high prices, but there’s a large number of customers who will buy it if you charge a fair price.”

The other complaint is that current offerings are “very high tech” and rich on features. “There are tons of customers who want simpler. The basic user is saying ‘please, just let me work out the effect of bond wire’,” he said.

McGillivary expects the market to be worth around $100m. “The expectations are fairly modest for this offering.”

The simulator will be launched in the first half of this year and McGillivary said the plan is to fully integrate it into Agilent’s circuit simulation software design platforms.

eesof.tm.agilent.com